Micro BGA Inspection

Micro BGA Inspection

Micro BGA is the latest advancement in Chip Scaling and Packaging (CSP) industry. It has reduced the ball grid array’s pitch size from 0.8 or 1.0 mm to less than 0.4 mm. While this has helped the packaging engineers to design much smaller and closely spaced printed circuit boards, it has also lead to increased complexity for fan out and routing. However, industry has growing demand for micro BGAs because of the advantages it provides in terms of improved chip delay performance and electrical performance.

Lately, under the “Green” initiative taken by many countries, shift is towards lead-free components. This has lead to a change in technology used for manufacturing BGAs. The lead-free solders demand higher temperatures to reflow them causing a major impact on smaller components like micro BGAs. This leads to additional defects due to high temperature variation and need to be inspected in order to confirm the quality standards of the manufacturing process. In addition, there are other defects that need to be checked for integrity and reliability of chip design. These include any kind of external or internal cracks and delamination.

CIT’s Digital Radiography technology is capable to inspect the defects arising during manufacturing and reflow phases. Its low cost and high resolution imaging plate scanners can scan up to 50 microns. The high quality and high resolution imaging plates enhances the image clarity and detail. This radiographic method is capable of checking the integrity of the BGA – material as well dimensions.

CIT also offers flat panel based digital radiography technology that can be used for real time inspections. The detectors are available in different active area sizes such as 100 x 100 mm, 200 x 250 mm and 222 x 222 mm. They are capable to work for wide energy range at different resolutions.

Digital Radiography is beneficial in terms of low inspection costs, increased productivity, low radiation dosage and secure data archiving.